| 摘要 |
A METHOD AND APPARATUS FOR PROCESSING LEADLESS SEMICONDUCTOR DEVICE (1) WHICH IMPROVE PROCESSING EFFICIENCY AND YIELDS FOR COMBINED PROCESSING STEPS IN WHICH LEADLESS SEMICONDUCTOR DEVICES (1) ENCAPSULATED IN A CSP OR THE LIKE ARE INDIVIDUALLY SUBJECTED TO CHARACTERISTICS MEASUREMENTS, MARKING OR THE LIKE, AND FINALLY PACKAGED BY TAPING. A DICING SHEET (2) FOR SUSTAINING MULTIPLE LEADLESS SEMICONDUCTOR DEVICES AT HIGH DENSITIES IS SUPPLIED TO A FEED TABLE (10), ON WHICH THE DICING SHEET (2) IS EXTENDED TO SPACE THE SEMICONDUCTOR DEVICES APART FROM ONE ANOTHER.WITH THIS ARRANGEMENT. THE SEMICONDUCTOR DEVICES ARE MOVED ONE BY ONE ON THE FEED TABLE (10) TO A PICK-UP POSITION AND THEN PICKED UP WITH A VACUUM NOZZLE OF THE FIRST TURNTABLE. THE SEMICONDUCTOR DEVICES ARE MOVED IN SEQUENCE TO A PLURALITY OF TURNTABLES (20, 30, 40, 50) WHICH ARE CONSECUTIVELY DISPOSED.AT THE MEASURING TABLE (30) ON THE WAY. THE SEMICONDUCTOR DEVICES ARE SUBJECTED IN ONE OR MORE TO AN ALIGNMENT CHECK AND CHARACTERISTICS MEASUREMENTS AT THE SAME TIME. FINALLY, GOOD SEMICONDUCTOR DEVICES ARE PACKAGED BY TAPING AT A TAPING MACHINE (60) FOR SHIPPING. (FIG. 1)
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