发明名称 WIRELESS MODULE ELEMENT AND ITS MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wireless module element and its mounting method capable of enhancing the productivity by promoting turning into small height. SOLUTION: The wireless module element is constituted by an IC chip, having a crystal connecting IC terminal nearer to the middle of the main surface, having an external connecting IC terminal including at least a power source, a ground, and an output terminal at a periphery of the main surface, and for integrating at least an oscillation circuit, and a surface-mounted vibrator, having an outline smaller than the IC chip and having an external crystal terminal provided on the outer bottom surface connected to the crystal connected to the IC terminal. In a manufacturing method of the wireless module element, the main surface of the IC chip is made to face a circuit board having a groove, the surface-mounted vibrator is embedded in the groove, and the external connecting IC terminal is made to be connected to a circuit terminal of the circuit board. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007082113(A) 申请公布日期 2007.03.29
申请号 JP20050270545 申请日期 2005.09.16
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 MIZUSAWA SHUICHI
分类号 H03B5/32 主分类号 H03B5/32
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