| 摘要 |
PROBLEM TO BE SOLVED: To prevent a deterioration of a reaction uniformity to a chemical in a semiconductor substrate surface, which is caused by a temperature distribution of the treatment chemicals on the semiconductor substrate surface when the semiconductor substrate is processed with the hot chemicals. SOLUTION: In the manufacturing method, a nozzle support arm 18 on which a plurality of chemical nozzles 4 which eject chemicals at the chemical processing temperature are mounted, corresponding to the plurality of different positions in the diametrical direction of the substrate 1, is arranged above the semiconductor substrate 1. The chemical is ejected from the plurality of chemical nozzles 4, while rotating the nozzle support arm 18 around an axis of rotation of the semiconductor substrate 1 for the reverse direction against the rotation direction of the semiconductor substrate 1. By rotating the surface of the semiconductor substrate 1, the high temperature chemical is supplied simultaneously on the plurality of different positions of the semiconductor substrate 1 in the diametrical direction. Thereby, the variation of the temperature of the chemical on the substrate surface is decreased, and the reaction uniformity of the chemical on the substrate surface can be enhanced. COPYRIGHT: (C)2007,JPO&INPIT
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