| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, having an excellent bonding property with a metal, also equipped with a good flowing property and excellent in forming property. SOLUTION: This epoxy resin composition for sealing the semiconductor contains the following (A) to (D) components. (A) An epoxy resin, (B) a phenol resin, (C) a silane-coupling agent having -S-S- bond in its molecular structure, and (D) a reductive compound. COPYRIGHT: (C)2007,JPO&INPIT
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