发明名称 ELECTRICAL CONNECTION STRUCTURE, LIQUID EJECTION HEAD, MANUFACTURING METHOD FOR LIQUID EJECTION HEAD, AND IMAGE FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electrical connection structure which can secure high connection reliability between electrodes and which can be also applied to the connection of many electrode groups arranged with a two-dimensional matrix structure, a liquid ejection head using the electrical connection structure, a manufacturing method for the liquid ejection head, and an image forming apparatus. SOLUTION: This electrical connection structure comprises: a first substrate (26) which is provided with a first electrode part (42); a second substrate (30-1) which is provided with a second electrode part (46-1) facing the electrode part (42), and a wiring pattern connected to the electrode part (46-1); an insulative cavity substrate (28) which is arranged between the first and second substrates (26) and (30-1), and in which a through-hole (28A) with a depth greater in dimension than the total (h1+h2) of the heights of the electrode parts (42) and (46-1) and an opening area (Sc) as large as/larger than an area (SL) of the electrode part (42) is formed in a position corresponding to the electrode part (42); and a conducting material (44) which is infilled into the through-hole (28A). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007076327(A) 申请公布日期 2007.03.29
申请号 JP20050270727 申请日期 2005.09.16
申请人 FUJIFILM CORP 发明人 MAEDA YASUHIKO
分类号 B41J2/045;B41J2/055;B41J2/16 主分类号 B41J2/045
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