发明名称 SOLDER ROLLING METHOD, AND SOLDER ROLLING MILL
摘要 PROBLEM TO BE SOLVED: To solve the problem that a solder is rolled by a rolling mill to obtain a solder material of the predetermined thickness in a process of manufacturing a form solder, oxide powder deposited on the roll of the rolling mill is shifted and adhered to the surface of the solder material, and wet spreading of the solder is not sufficient when soldering is performed by using the form solder made of the soldering material. SOLUTION: In a solder rolling method, the solder is rolled while wiping the surface of a roll of a rolling mill with oxide powder deposited thereon by a wiping material mounted on a pressing device. Further, in the solder rolling mill, pressing components of the pressing device for removing the oxide powder deposited on the roll are an air cylinder, a long screw, a spring or the like, and the wiping material is mounted on the pressing device. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007075863(A) 申请公布日期 2007.03.29
申请号 JP20050268210 申请日期 2005.09.15
申请人 SENJU METAL IND CO LTD;DENSO CORP 发明人 HIRANO NAOHIKO;TANAHASHI AKIRA;SAKAMOTO ZENJI;SUKEGAWA SHOJI;MUNAKATA OSAMU;YOSHIDA KOJIRO;WATANABE HIROYUKI;KITAURA HIDETOSHI
分类号 B23K35/40;B21B3/00;B21B28/04 主分类号 B23K35/40
代理机构 代理人
主权项
地址