发明名称 FLOOR COOLING/HEATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To obtain a floor structure structured so that heat exchange is possible with adjacent water containers for uniformizing the temperatures of the water containers each arranged in space parts partitioned by joists. SOLUTION: The joists 1 are structured by a high heat conduction material such as aluminum. In each of the spaces partitioned by the joists 1, the water containers 4 are arranged, respectively, and a floor face 5 is formed at the top part of each of the water containers 4 by laying floor boards. When sun beams S radiate non-uniformly on the entire surface of the floor face 5, heat H of the water container 4 that is the most heated is transferred to adjacent water containers 4 sequentially via the joists 1. As such, each of the water containers 4 become integral thermally, and ultimately, the temperatures of the floor face 5 becomes uniform. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007078256(A) 申请公布日期 2007.03.29
申请号 JP20050266653 申请日期 2005.09.14
申请人 IZENA:KK 发明人 MAEDA SEIICHI
分类号 F24D11/00;E04F15/18;F24D3/16 主分类号 F24D11/00
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