APPARATUS FOR SIMULATION OF HEAT GENERATION OF ELECTRONIC COMPONENTS

摘要

Disclosed is an apparatus ( 10 ) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device ( 110 ), a base ( 120 ) and at least one supporting post ( 150 ). The base is made of a heat-insulation material, and defines therein a recess ( 122 ). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.