| 摘要 |
The present invention relates to a die package and method for making the same. The method of the invention comprises the steps of: (a) providing a plate, having a first surface and a second surface; (b) forming a plurality of first dice on the plate, the first dice having a first surface and a second surface; (c) forming a plurality of bumps on the first surface of the first dice; and (d) cutting the plate to form a plurality of die modules, each module comprising a plate unit, a first die and a plurality of bumps, the first die disposed on a first surface of the plate unit, whereby the bumps could be easily mounted on the single die.
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