发明名称 |
Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same |
摘要 |
A wiring structure may include a pad, a conductive pattern and an insulating photoresist structure. The pad may be provided on a body and electrically connected to a circuit unit of the body. The conductive pattern may be provided on the body and may be electrically connected to the pad. The insulating photoresist structure may be provided on a surface of the conductive pattern. The insulating photoresist structure may have a contact hole through which the conductive pattern may be partially exposed. The insulating photoresist structure may be fabricated by providing a photosensitive photoresist film on the conductive layer, and patterning the photosensitive photoresist film by two photo processes.
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申请公布号 |
US2007069320(A1) |
申请公布日期 |
2007.03.29 |
申请号 |
US20060486041 |
申请日期 |
2006.07.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE IN-YOUNG;SIM SUNG-MIN;JANG DONG-HYEON;CHUNG HYUN-SOO;CHUNG JAE-SIK;RYU SEUNG-KWAN;PARK MYEONG-SOON;YOON JONG-KOOK;CHOI JU-IL |
分类号 |
H01L31/00 |
主分类号 |
H01L31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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