| 摘要 |
In a method for manufacturing an integrated semiconductor device with low capacitive coupling between a conductive member and a via, a semiconductor substrate with a surface is provided. The conductive member is formed on the surface of the substrate wherein the conductive member is provided for conducting a current in a direction parallel to the surface of the substrate. A sacrifice structure is produced. A via is formed for conducting a current in a direction vertical to the surface of the substrate. The sacrifice structure at least partially defines the shape and position of the via and separates the conductive member and the via. The sacrifice structure is removed thereby generating a void in place of the sacrifice structure.
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