发明名称 Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement
摘要 An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structure levels in which in each case elongated interconnects are arranged.
申请公布号 US2007071052(A1) 申请公布日期 2007.03.29
申请号 US20060525111 申请日期 2006.09.21
申请人 发明人 HOMMEL MARTINA;KOERNER HEINRICH;SCHWERD MARKUS;SECK MARTIN
分类号 H01S5/00;H01S3/13 主分类号 H01S5/00
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