发明名称 |
Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement |
摘要 |
An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structure levels in which in each case elongated interconnects are arranged.
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申请公布号 |
US2007071052(A1) |
申请公布日期 |
2007.03.29 |
申请号 |
US20060525111 |
申请日期 |
2006.09.21 |
申请人 |
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发明人 |
HOMMEL MARTINA;KOERNER HEINRICH;SCHWERD MARKUS;SECK MARTIN |
分类号 |
H01S5/00;H01S3/13 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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