发明名称 |
Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components with a connecting element and an insulating molded body |
摘要 |
<p>Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components (70) with a connecting element and an insulating molded body (80). The substrate comprises an insulated body (54) and connecting pathways (52) facing the inside of the module. A connection between a semiconductor component and a connecting element or between the semiconductor component and the connecting pathway is a pressure sintered connection. An independent claim is also included for a method for the production of a power semiconductor module.</p> |
申请公布号 |
DE102005047567(B3) |
申请公布日期 |
2007.03.29 |
申请号 |
DE20051047567 |
申请日期 |
2005.10.05 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
HEILBRONNER, HEINRICH;KOBOLLA, HARALD |
分类号 |
H01L23/24;H01L21/54;H01L25/07 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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