发明名称 |
METHOD OF MANUFACTURING NITRIDE-BASED SEMICONDUCTOR LIGHT-EMITTING ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing nitride-based semiconductor light-emitting elements which is reduced in warpage after being peeled off from a substrate and can efficiently extract light from a side face. <P>SOLUTION: The method of manufacturing a plurality of nitride-based semiconductor light-emitting elements 2 is provided with a process of laminating at least an n-type semiconductor layer 103, a light-emitting layer 104 and a p-type semiconductor layer 105 in this order on a substrate 101 to form a laminate; a process of dividing the laminate so as to correspond to each of the elements 2 on which the laminate is manufactured by forming grooves 4 on the substrate 101; a process of filling each of the grooves 4 with a sacrificial layer 106; and a plating process of forming a plated substrate 111 by a plating method on the p-type semiconductor layer 105 and the sacrificial layer 106. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007081312(A) |
申请公布日期 |
2007.03.29 |
申请号 |
JP20050270565 |
申请日期 |
2005.09.16 |
申请人 |
SHOWA DENKO KK |
发明人 |
OSAWA HIROSHI;HODOTA TAKASHI |
分类号 |
H01L33/12;H01L33/32;H01L33/38;H01L33/40 |
主分类号 |
H01L33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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