| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently radiate heat generating from an LED chip. <P>SOLUTION: A package 10 has a multilayer structure which is comprised of a section 10a made of metal such as Al or Cu, and a section 10b made of a ceramic material (AlN or the like) with high thermal conductivity; and the metallic section 10a is arranged on the side of a recess 11 wherein an LED chip 1 is mounted. Heat generating from the LED chip 1 is conducted to the metallic section 10a of the package 10 through a submount member 2, and it is conducted to the ceramic section 10b from the metallic section 10a, and then it is radiated as radiation heat from the ceramic section 10b. Therefore, when compared with a case when the package 10 is entirely formed of a ceramic material, heat generating from the LED chip 1 can be efficiently radiated. <P>COPYRIGHT: (C)2007,JPO&INPIT |
