| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot plate unit for securing the satisfactory temperature uniformity of even a wafer whose bending is temporarily generated in the case of heat treatment, and for suppressing the adhesion of dust to the wafer. SOLUTION: A host plate 11 is provided with a point contact placing part 16 on which a wafer W is placed by point contact and a face contact placing part 15 on which the wafer W is placed by face contact. The hot plate 11 has a communication hole 17 for making a counter region 11a at the counter side of the wafer W communicate with an anti-counter region 11b positioned at the opposite side. Then, when carrying out the heat treatment of the wafer W, air between the counter region 11a of the hot plate 11 and the lower face of the wafer W is sucked through the communication hole 17 so that the bending of the wafer W can be corrected by a load at that time. COPYRIGHT: (C)2007,JPO&INPIT |
