| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which has a long temperature cycle life by reducing stress generated at an inter-layer connection part of a pad-on-via structure. SOLUTION: The printed wiring board has a multi-layered structure wherein a wire of an internal layer and a land of an external layer are connected by an inter-layer connection part, has a solder resist opening part over the land, and is used to mount an electronic component on the land part across a solder bump, and the center position of the inter-layer connection part is formed inside the outer periphery of the solder resist opening part and shifts from the center position of the solder-resist opening part toward the center of the electronic component. COPYRIGHT: (C)2007,JPO&INPIT
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