发明名称 EVAPORATIVE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an evaporative cooling device capable of uniformly cooling the whole object to be cooled by evaporative cooling. SOLUTION: A plurality of capillaries 2 having an approximately rectangular cross section are mounted inside of a horizontally-long cylindrical shell 1. A cooling fluid supply tube 3 is connected with an upper portion of the shell 1. A suction means connecting tube 4 is connected with a lower portion of the shell 1. A communicating tube 9 is mounted to connect the upper portion of the shell 1 and the suction means connecting tube 4. By injecting the cooling fluid into the capillaries 2 in the shell 1 from the cooling fluid supply tube 3, the cooling fluid flows down on longitudinal rectangular side face portions of the capillaries 2, absorbs the heat of the object to be cooled in the capillaries 2, and is evaporated, thus the whole object can be uniformly cooled by evaporative cooling. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007078276(A) 申请公布日期 2007.03.29
申请号 JP20050268143 申请日期 2005.09.15
申请人 TLV CO LTD 发明人 MORII TAKAYUKI
分类号 F25D9/00;F25D7/00;F28D1/06 主分类号 F25D9/00
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