| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin exhibiting excellent fluidity without reducing properties such as low moisture absorption and high heat resistance, enabling an inorganic filler to be filled in high content, exhibiting nonconventional excellent resistance to solder crack as a semiconductor-sealing material, having extremely superior curability to extremely improve the productivity of a molded product of a semiconductor or the like. SOLUTION: The method for producing the epoxy resin comprises reacting (a) a mixture of polyhydric phenols which is an addition polymerization product between an unsaturated aliphatic cyclic hydrocarbon compound having two double bonds in one molecule and exemplified by cyclopentadiene and phenols and which has≥95 mass% content of a binuclear body in the addition polymerization product, with (b) an epihalohydrin. COPYRIGHT: (C)2007,JPO&INPIT
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