| 摘要 |
To provide a semiconductor device 10 , which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10 A has a configuration such that in semiconductor device 10 A, wherein an optical semiconductor element 14 , having a light receiving part or a light emitting part, is sealed in a sealing resin 13 , a cover layer 12 , covering the top surface of optical semiconductor element 14 , is exposed from the top surface of sealing resin 13 . Thus in comparison to a related-art example with which the entirety is sealed by a transparent resin, sealing resin 13 can be formed thinly and the thickness of the entire device can be made thin. Furthermore, semiconductor device 10 is arranged using a sealing resin having a filler mixed in. A semiconductor device that is excellent in mechanical strength and humidity resistance can thus be arranged.
|
