RESIN COMPOSITION, COVERLAY FILM USING IT AND METAL-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for flexible printed circuit boards exhibiting both high flexibility and folding endurance. SOLUTION: The resin composition is used for flexible printed circuit boards, contains a biphenyl aralkyl epoxy resin, a novolac phenolic resin and a reactive ester compound. The resin composition further contains a phosphate amide. The resin composition further contains a carboxylic acid-modified NBR for its elastomer. The hydroxyl group equialent of the novolac phenolic resin and the ester group equivalent of the reactive ester compound per one epoxy group equivalent in the total amount of the epoxy resin are not less than (0.3:0.7) equivalent and not more than (0.7:0.3) equivalent respectively. COPYRIGHT: (C)2007,JPO&INPIT