发明名称 PLASMA TREATING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plasma treating method and device capable of keeping a temperature at a low value while flatly keeping a flexible board as a sheet. SOLUTION: The plasma treating device is composed of a vacuum chamber, a gas supply means supplying the inside of the vacuum chamber with a gas and an exhaust means exhausting the inside of the vacuum chamber. The plasma treating device is further composed of a pressure control valve controlling the inside of the vacuum chamber at a specified pressure, an electrode with a placed tray holding the board and a power supply applying a power to the electrode. In such a plasma treating device, the tray has a detachable pressure-sensitive adhesive sheet on its surface, and the pressure-sensitive adhesive sheet has a shape having irregularities. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007081178(A) 申请公布日期 2007.03.29
申请号 JP20050267840 申请日期 2005.09.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAGI KIYOHIKO;YAMAMOTO MASAHIRO;UCHIDA TORU
分类号 H01L21/683;H01L21/3065;H01L21/31 主分类号 H01L21/683
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