发明名称 Stacked capacitor and method of fabricating same
摘要 The invention relates to a stacked capacitor ( 10 ) comprising a silicon base plate ( 16 ), a poly-silicon center plate ( 32 ) arranged above the base plate ( 16 ), a lower gate-oxide dielectric ( 26 ) arranged between the base plate ( 16 ) and the center plate ( 32 ), a cover plate ( 36 ) made of a metallic conductor and arranged above the center plate ( 32 ), and an upper dielectric ( 34 ) arranged between the center plate ( 32 ) and the cover plate ( 36 ). The cover plate ( 36 ) and the base plate ( 16 ) are electrically connected to each other and together form a first capacitor electrode. The center plate ( 32 ) forms a second capacitor electrode. The invention further relates to an integrated circuit with such a stacked capacitor, as well as to a method for fabrication of a stacked capacitor as part of a CMOS process.
申请公布号 US2007069269(A1) 申请公布日期 2007.03.29
申请号 US20060549248 申请日期 2006.10.13
申请人 BALSTER SCOTT;EL-KAREH BADIH;STEINMANN PHILIPP;DIRNECKER CHRISTOPH 发明人 BALSTER SCOTT;EL-KAREH BADIH;STEINMANN PHILIPP;DIRNECKER CHRISTOPH
分类号 H01L27/108;H01L21/02;H01L27/06;H01L27/08;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/108
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