发明名称 |
Stacked capacitor and method of fabricating same |
摘要 |
The invention relates to a stacked capacitor ( 10 ) comprising a silicon base plate ( 16 ), a poly-silicon center plate ( 32 ) arranged above the base plate ( 16 ), a lower gate-oxide dielectric ( 26 ) arranged between the base plate ( 16 ) and the center plate ( 32 ), a cover plate ( 36 ) made of a metallic conductor and arranged above the center plate ( 32 ), and an upper dielectric ( 34 ) arranged between the center plate ( 32 ) and the cover plate ( 36 ). The cover plate ( 36 ) and the base plate ( 16 ) are electrically connected to each other and together form a first capacitor electrode. The center plate ( 32 ) forms a second capacitor electrode. The invention further relates to an integrated circuit with such a stacked capacitor, as well as to a method for fabrication of a stacked capacitor as part of a CMOS process.
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申请公布号 |
US2007069269(A1) |
申请公布日期 |
2007.03.29 |
申请号 |
US20060549248 |
申请日期 |
2006.10.13 |
申请人 |
BALSTER SCOTT;EL-KAREH BADIH;STEINMANN PHILIPP;DIRNECKER CHRISTOPH |
发明人 |
BALSTER SCOTT;EL-KAREH BADIH;STEINMANN PHILIPP;DIRNECKER CHRISTOPH |
分类号 |
H01L27/108;H01L21/02;H01L27/06;H01L27/08;H01L29/76;H01L29/94;H01L31/119 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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