发明名称 Phase change memory device and method of manufacturing the device
摘要 The invention provides a novel structure of a phase change memory device. In the phase change memory device of the invention, an electrode acting as a radiating fin does not exit immediately above a phase change area of a phase change layer ( 115 ). A heater electrode ( 111 ) and landing electrode layer ( 113 a, 114 a) both contact the bottom of the phase change layer ( 115 ) made of GST. The landing electrode layer ( 113 a, 114 a) contacts the bottom of the phase change layer (115) to partially overlap in a region off from a portion immediately above the contact face (Y) of the phase change layer and heater electrode. The contact electrode ( 116, 118 ) is directly connected to the landing electrode layer ( 113 a, 114 a) in a portion off from a portion immediately above the heater electrode ( 111 ). The phase change layer of GST or the like does not exist immediately below the contact electrode.
申请公布号 US2007069249(A1) 申请公布日期 2007.03.29
申请号 US20060518172 申请日期 2006.09.11
申请人 ELPIDA MEMORY INC. 发明人 HAYAKAWA TSUTOMU
分类号 H01L29/768 主分类号 H01L29/768
代理机构 代理人
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