| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate bonding device in which a pressing force is provided corresponding with a size of a substrate when an upper substrate and a lower substrate is bonded together, and provide a substrate bonding method using the same. <P>SOLUTION: A substrate bonding device is composed of an upper plate 210 structured to press an upper substrate 100, an upper pressing part 200 including a pressing means structured to apply a pressing force on the above upper plate, a lower plate 410, which holds a lower substrate 140 located under the above pressing part and to be bonded with the above upper substrate, and which is structured to press the above lower substrate, and a lower pressing part 400 including a pressing means structured to apply a pressing force on the above lower plate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
