| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure for preventing degradation in electric characteristics caused by poor bonding between a semiconductor element and a substrate due to air pooling as well as cracking due to thermal distortion. <P>SOLUTION: In the semiconductor device, a semiconductor element 2 is bonded to a mounting part 3 on the surface of a substrate 1 through an adhesive 6. A recess 8 with an obtuse concave start angle from the surface of the substrate 1 is provided on the position of the surface of substrate 1 that faces the edge of the semiconductor element 2. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
