发明名称 |
PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE |
摘要 |
A process for fabricating a chip package structure is disclosed. To fabricate the chip package structure, a carrier and a plurality of chips are provided. Each chip has an active surface and at least one of the active surfaces has a plurality of bumps thereon. The chips and the carrier are electrically connected together. Thereafter, a heat sink is attached to the back of the chips and then at least one heat-resistant buffering film is formed over part of the heat sink surface. An encapsulating material layer is formed over the carrier and filling bonding gaps between the chips and the carrier. The encapsulating material within the bonding gaps has a thickness. The maximum diameter of particles constituting the encapsulating material layer is less than half of the said thickness. |
申请公布号 |
US2007072339(A1) |
申请公布日期 |
2007.03.29 |
申请号 |
US20060309106 |
申请日期 |
2006.06.23 |
申请人 |
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发明人 |
CHEN KAI-CHI;HUANG SHU-CHEN;LI HSUN-TIEN;LEE TZONG-MING;FUKUI TARO;NEMOTO TOMOAKI |
分类号 |
H01L21/00;H01L23/31;H01L23/433 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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