| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of estimating a changing status of the copper concentration of solder with a time lapse in a solder tank on the basis of several basic data. SOLUTION: A relationship between the copper concentration of solder and the melting rate of copper in a lead of an electronic part and an exposed electrode of a circuit board, or a relationship between the removal time interval of dross and the quantity of produced dross is acquired beforehand, and these relationships are used to estimate and calculate a change in the copper concentration of solder with a time lapse in the solder tank. COPYRIGHT: (C)2007,JPO&INPIT |
