发明名称 RESIN MOLDING METHOD AND EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To enhance, in the resin molding equipment wherein a molten resin is discharged on a mold through a T die, homogeneity of properties of the molten resin within one shot which is discharged on the mold. SOLUTION: The injection apparatus 1 is installed with the T die 5 in its discharge port. By discharging the molten resin from the injection apparatus 1 on the mold through the T die 5 and performing the mold clamping, the resin product is manufactured. In this resin molding method, as the T die 5, there is used the one whose internal volume is equivalent to or more than the amount of the molten resin discharged by one shot of the injection apparatus. In manufacturing the resin product, the T die 5 holds the molten resin in its inside for a period longer than the injection cycle of the injection apparatus, meantime enhances the homogeneity of the temperature of the molten resin, and then discharges the molten resin on the mold. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007076180(A) 申请公布日期 2007.03.29
申请号 JP20050267228 申请日期 2005.09.14
申请人 TOSHIBA MACH CO LTD 发明人 ISHII YUSUKE;KITSUTA HIDEAKI
分类号 B29C45/46;B29C47/14;B29L7/00 主分类号 B29C45/46
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