| 摘要 |
A coil comprises a layer of permeable material ( 4 ) deposited in a chip (CH) of an integrated circuit (IC) in a plane substantially parallel to a surface (A) of a substrate ( 1 ) of the chip (CH). A first conductor element ( 6 a, 6 b; BW 10 , BWI 1; 60 a, 60 b) is arranged at a first side of the permeable material ( 4 ) facing away from the substrate ( 1 ). A second conductor element ( 2 a, 2 b; T 1 , T 2 ) is arranged at a second side of the permeable material ( 4 ) opposite to the first side. An interconnection ( 8 a, 8 b; P 2 , P 4 ) interconnects a first end of the first conductor element ( 6 a, 6 b; BW 10 , BWI 1; 60 a, 60 b) and a first end of the second conductor element ( 2 a, 2 b; T 1 , T 2 ). The interconnection ( 8 a, 8 b; P 2 , P 4 ), the first conductor element ( 6 a, 6 b; BW 10 , BW 11; 60 a, 60 b) and the second conductor element ( 2 a, 2 b; T 1 , T 2 ) are arranged to form a winding around the permeable material ( 4 ). The winding extends in a plane substantially perpendicular to the surface (A) of the substrate ( 1 ) to conduct current ( 1 ) in a plane substantially perpendicular to the surface (A) of the substrate ( 1 ). |
