发明名称 PASTY METAL PARTICLE COMPOSITION, METHOD OF HARDENING PASTY METAL PARTICLE COMPOSITION, METHOD OF BONDING METAL MEMBER, PROCESS FOR PRODUCING PRINTED WIRING BOARD
摘要 <p>[PROBLEMS] To provide a pasty metal particle composition from which a solid metal excelling in strength, electrical conductivity and thermal conductance is obtained through sintering of metal particles within an extremely short period of time; a method of hardening the pasty metal particle composition; etc. [MEANS FOR SOLVING PROBLEMS] There are provided a pasty metal particle composition comprising metal particles of 0.1 to 30 µm average particle diameter and 2.0 wt.% or less carbon content and a volatile dispersion medium; a method of hardening a pasty metal particle composition, comprising applying supersonic vibration to the composition under pressure, especially under pressure and heating, to thereby evaporate the volatile dispersion medium and thus effect sintering of the metal particles; a method of bonding metal members, comprising interposing a pasty metal particle composition between metal members and applying supersonic vibration thereto under pressure, especially under pressure and heating; and a process for producing a printed wiring board, comprising applying supersonic vibration to a pasty metal particle composition on a substrate under pressure, especially under pressure and heating, to thereby form a metal wiring.</p>
申请公布号 WO2007034893(A1) 申请公布日期 2007.03.29
申请号 WO2006JP318774 申请日期 2006.09.21
申请人 NIHON HANDA CO., LTD.;YAMAKAWA, KIMIO;MINE, KATSUTOSHI 发明人 YAMAKAWA, KIMIO;MINE, KATSUTOSHI
分类号 B22F3/14;B22F1/00;B22F9/00;B23K20/10;B23K35/02;H01B1/22;H01L21/60;H01L21/607;H05K3/10;H05K3/20;H05K3/32 主分类号 B22F3/14
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