| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor in which a generation of warping is decreased, and adhesive properties to a solder resist of a substrate surface are also excellent. <P>SOLUTION: The epoxy resin composition for sealing the semiconductor contains components (A) to (C). The component (A) is an epoxy resin having an epoxy resin represented by a structural formula (1) as a main component (A), the component (B) is a phenol resin, and the component (C) is an imidazole-based curing accelerator. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
