| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board suitable for multilayering. <P>SOLUTION: The method of manufacturing the printed wiring board comprises: a first step of positionally adjusting a first buildup layer 20 where a plurality of wiring layers 24, 26 and 28 and insulating layers 23, 25 and 27 are alternately laminated on a metal plate 21 and wiring layers are connected each other by vias and a second buildup layer 40 where a plurality of wiring layers 44, 46 and 48 and insulating layers 43, 45 and 47 are alternately laminated on a metal plate 41 and wiring layers are connected each other by vias so that the metal plate 21 and the metal plate 41 each face outward, and then bonding the wiring layers 48 and 28 of the buildup layers 20 and 40 respectively by electrically connecting each other; and a second step of simultaneously removing the metal plate 21 and the metal plate 41 by etching. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
