| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method for improving line width uniformity in a pattern. SOLUTION: In the substrate treatment apparatus, a substrate whose exposure treatment is completed in an exposing unit at a time t1 is carried into a cleaning treatment unit. The residence time (standby time or cleaning time) of the substrate after exposure in the cleaning treatment unit is adjusted, and a cleaning treatment end point is adjusted so that a time from the exposure treatment completion time t1 to a cleaning treatment complete time t5 becomes constant, thus making constant a time from the exposure treatment completion time to a heat treatment start time after exposure and making constant a time from the cleaning treatment completion time to the heat treatment start time after exposure and thereby improving the line width uniformity in the pattern when using a chemical amplification type resist. COPYRIGHT: (C)2007,JPO&INPIT |
