| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead free alloy for soldering having excellent wettability and adhesion, and having excellent reliability in spite of a lead free solder constitution. SOLUTION: The lead free alloy has a composition comprising, by weight, 0.05 to 1.5% copper (Cu), 0.001 to 0.5% nickel (Ni), 0.001 to 0.5% phosphorous, 0.001 to 0.5% gallium (Ga), and the balance tin (Sn), and, according to the selection of the composition, the improvement of wettability by tin, the improvement of joining strength by copper, the improvement of mechanical strength by nickel, and the prevention of oxidation by phosphor can be effectively exhibited. Thus the lead free solder having high wettability, adhesion and reliability can be produced. COPYRIGHT: (C)2007,JPO&INPIT
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