发明名称 Method of forming a low resistance semiconductor contact and structure therefor
摘要 In one embodiment, silicide layers are formed on two oppositely doped adjacent semiconductor regions. A conductor material is formed electrically contacting both of the two silicides.
申请公布号 US2007072416(A1) 申请公布日期 2007.03.29
申请号 US20050232757 申请日期 2005.09.23
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 GRIVNA GORDON M.;VENKATRAMAN PRASAD
分类号 H01L21/44;H01L21/336 主分类号 H01L21/44
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