发明名称 Process to manufacture multi-layer thin-film electrical capacitors in which alternate pairs of materials are transposed relative to each other
摘要 <p>In a process to manufacture a multi-layer thin-film electrical capacitor the substrate and screen are co-located, followed by presentation of electrodes, dielectric layers, and arrangement of the stack. The stack is then separated as required into individual units followed by contact between the material and electrodes (3). Alternate pairs of materials are transposed in first and second positions relative to each other.</p>
申请公布号 DE102005037875(B3) 申请公布日期 2007.03.29
申请号 DE20051037875 申请日期 2005.08.10
申请人 SIEMENS AG 发明人 REBHAN, MATTHIAS
分类号 H01G4/33;H01G4/005;H01G4/232;H01L49/02 主分类号 H01G4/33
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