发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATION THEREOF
摘要 <p>A semiconductor device includes a substrate formed of a single crystal. a silicon carbide layer disposed on a surface of the single crystal substrate and an intermediate layer disposed on a surface of the silicon carbide layer and formed of a Group III nitride semiconductor, wherein the silicon carbide layer is formed of a cubic crystal stoichiometrically containing silicon copiously and the surface thereof has a (3 x 3) reconstruction structure. The semiconductor device is fabricated by a method including a first step of blowing a hydrocarbon gas on the surface of the substrate, thereby inducing adsorption of hydrocarbon thereon, a second step of heating the substrate having adsorbed the hydrocarbon to a temperature exceeding a temperature used for the adsorption of the hydrocarbon while irradiating the surface of the substrate with electrons and consequently giving rise to a silicon carbide layer formed of a cubic crystal stoichiometrically containing silicon copiously and provided with a surface having a (3 x 3) reconstruction structure and a third step of supplying a gaseous raw material containing nitrogen and a gaseous raw material containing a Group III element to the surface of the silicon carbide layer and consequently giving rise to the intermediate layer formed of the Group III nitride semiconductor.</p>
申请公布号 WO2007034761(A1) 申请公布日期 2007.03.29
申请号 WO2006JP318455 申请日期 2006.09.12
申请人 SHOWA DENKO K.K.;UDAGAWA, TAKASHI 发明人 UDAGAWA, TAKASHI
分类号 H01L21/20;H01L21/205;H01L21/338;H01L29/778;H01L29/812;H01L33/00;H01L33/16 主分类号 H01L21/20
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