| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device with which a via hole can be formed with simple positioning. SOLUTION: The manufacturing method has a process for forming a semiconductor integrated circuit on a surface 11 of a wafer 1, a process for forming the via hole 3 in a ground electrode (or wiring) 2 formed on the surface 11 of the wafer 1 and in the wafer 1 below it, a process for embedding an embedded metal layer 4 in the via hole 3, a process for thinning the wafer 1 from the rear face of the wafer 1 and exposing the embedded metal layer 4, and a process for forming a ground layer 5 on the rear face 12 of the wafer 1. COPYRIGHT: (C)2007,JPO&INPIT
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