| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which unevenness of cooling of a semiconductor chip is suppressed. SOLUTION: The semiconductor device is provided with a semiconductor chip 11 having a cooling pipe 17 which is provided on a main surface of a semiconductor substrate 10 having an element forming portion 13 if a semiconductor element etc. formed thereon, and on a portion between the main surface and a rear surface of the semiconductor substrate 10 opposite to the main surface, and does not branch; a package substrate 26 for placing the semiconductor chip 11; bumps 33 for electrically connecting the element forming portion 13; a sealing resin 31 for sealing the semiconductor chip 11; and a connection terminal 19 having a through-hole communicating to the cooling pipe 17. COPYRIGHT: (C)2007,JPO&INPIT |
