| 摘要 |
PROBLEM TO BE SOLVED: To provide an oxetane thermosetting composition exhibiting an excellent thermosetting rate, and a cured product excellent in mechanical properties, electrical properties, adhesive properties, heat resistance, moisture resistance, chemical resistance and other properties. SOLUTION: The thermosetting resin composition comprises as essential ingredients (A) an oxetane compound bearing an oxetane functional group represented by general formula (I) (wherein R<SB>1</SB>is a hydrogen atom, 1-6C alkyl group, fluorine atom, 1-6C fluoroalkyl group, allyl group, aryl group, aralkyl groups, furyl group or thienyl group), (B) a polyhydric phenolic compound bearing at least two phenolic hydroxy group in one molecule, (C) a compound bearing a reactive silicon, and (D) an organoaluminum compound. COPYRIGHT: (C)2007,JPO&INPIT
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