| 发明名称 |
Compositions effective to suppress void formation |
| 摘要 |
A composition for use with a lead free solder is provided. In certain examples, the composition comprises an effective amount of a phenol to suppress void formation. Underfill compositions and devices that include the composition are also disclosed.
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| 申请公布号 |
US2007073008(A1) |
申请公布日期 |
2007.03.29 |
| 申请号 |
US20050237610 |
申请日期 |
2005.09.28 |
| 申请人 |
COOKSON SINGAPORE PTE, LTD. |
发明人 |
HURLEY JAMES;KANAGAVEL SENTHIL;AVDIC SAMIR;DHOBLE AVIN;BERFIELD TANYA |
| 分类号 |
C08L63/02;C08L61/12 |
主分类号 |
C08L63/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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