摘要 |
A p-type base layer shaped like a well is formed for each of IGBT cells, and a p<SUP>+</SUP>-type collector layer and an n<SUP>+</SUP>-type cathode layer are formed on a surface opposite to a surface on which the p-type base layer is formed so as to be situated just below the p-type base layer. The p-type base layer of each of the IGBT cells includes a flat region including an emitter region and a bottom surface penetrated by a main trench, and first and second side diffusion regions between which the flat region is interposed. The first side diffusion region is situated just above the n<SUP>+</SUP>-type cathode layer and each of the bottom surfaces of the side diffusion regions forms a parabola-shaped smooth curve in longitudinal section. By replacing the p<SUP>+</SUP>-type collector layer with the n<SUP>+</SUP>-type cathode layer, it is possible to apply features of the above structure to a power MOSFET.
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