<p>A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration.</p>
申请公布号
WO2007035862(A2)
申请公布日期
2007.03.29
申请号
WO2006US36797
申请日期
2006.09.21
申请人
INTERNATIONAL RECTIFIER CORPORATION;HU, KUNZHONG;CHEAH, CHUAN
