Einzelzeilen-Verbindungsfeld-Anordnung eines integrierten Schaltungs Chips

摘要

An integrated circuit chip with its interconnecting pads re-arranged in substantially a straight line. The pads are ordered in the straight line so that wire bond connections to contact terminal of an IC package allows the wire bonds to not interfere with each other by traveling under or over other wire bonds. This re-arrangement and ordering of an IC's pads allows a single die constructed in accordance with this invention to be mounted in both a package that is designed to accept a die-down type chip and a package designed to accept a die-up type chip. This mounting of the single chip occurs directly without any other transition artifacts, like transition substrates, etc., that would carry the reversal of the effective pad locations.