| 摘要 |
<p>A semiconductor package (1) includes: a first substrate (10) including: a semiconductor base material (11) having a first side and a second side; a functional element (12) that is provided at the first side of the semiconductor base material (11); a first wiring (13); a pad (14) that is electrically connected to the functional element (12) via the first wiring (13); a through-hole interconnection (15) that is electrically connected to the pad (14) and is provided in a hole that is defined penetrating the semiconductor base material (11) from the first side thereof to the second side thereof, the through-hole interconnection (15) including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material (30) provided surrounding the functional element (12); a second substrate (20) that is bonded to a first side of the first substrate (10) via the sealing material (30).</p> |
