| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed board which is thin, lightweight, soft, tough and flexible without using an adhesive agent. SOLUTION: An organic high-molecular film is formed as an insulating base (1) on one of the surfaces of a conductive sheet or a foil by a vapor deposition polymerization method, and a prescribed circuit pattern (3) is formed on the insulating base (1) by subjecting the conductive sheet or the foil to processing to form the printed board. COPYRIGHT: (C)2007,JPO&INPIT
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