| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for mounting a semiconductor device capable of suppressing a manufacturing cost of a mother board by reducing the number of its layers which are required for a BGA semiconductor device to be mounted on the mother board. SOLUTION: This socket for mounting a semiconductor device comprises a lower side bracket 11, an upper side bracket 20, an adjustment bracket 30, a cover 40, a lower side anisotropic conductive sheet 50, a pad pitch conversion base 60, and an upper side anisotropic conductive sheet 70. The pad pitch conversion base 60 is formed in such a manner that a semiconductor device side pad 81 or the like arranged on the upper surface and formed in a grid-like pattern with a pitch is converted to a mother board side pad, arranged on the bottom surface which is formed in a grid-like pattern with a pitch of about two times of that of the semiconductor device side pad. The pad of a mother board is arranged to correspond to the pitch of the mother board side pad of the pad pitch conversion base 60. COPYRIGHT: (C)2007,JPO&INPIT
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