| 摘要 |
A system for electrically contacting a semiconductor wafer (22 in Fig. 1) during implanting of the wafer includes one or more pairs of closely spaced contacts located adjacent the wafer (12a and 12b in Fig 1) and a driving circuit connected to the contacts to provide a discharge from one contact to the wafer and from the wafer to the other contacts The contacts can be spaced apart from the wafer in the establishment of corona at lower drive voltages. Alternately, the contacts may be rounded (50,52 in Fig 4) and may contact the wafer. The driving circuit may be adapted from a pulsed dischaige circuit, such as a Kettering ignition circuit, a capacitance discharge ignition circuit, a blocking oscillator circuit, or a Tesla coil circuit. |
