| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for coating an electroconductive paste to form an electrode in an electronic component such as a microminiature chip component, and to provide a coating method. <P>SOLUTION: This electroconductive paste coating apparatus for an electronic component comprises a first jig means provided with paste filling holes through which knockout pins are passed while filling an electroconductive paste, and a movable second jig means provided with knockout pins which are inserted into the paste filling holes in the first jig means and realize coating of an electronic component with the electroconductive paste. The chip component is coated with the electroconductive paste while being loaded or unloaded toward the first jig means. The coating apparatus can of course accurately coat an electroconductive paste onto electronic components such as microminiature chip components and further can easily regulate the coverage, can prevent bleeding or uneven coating in electrode formation, and can improve paste coating quality as a whole. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
